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Ohyabu N, Narihara K, Funaba H, et al. Edge thermal transport barrier In LHD discharges. Phys Rev Lett. 2000;84(1):103-6doi: 10.1103/PhysRevLett.84.103.
Ohyabu, N., Narihara, K., Funaba, H., Morisaki, T., Masuzaki, S., Kawahata, K., Komori, A., Kaneko, O., Yamada, H., deVries, P., Emoto, M., Goto, M., Hamada, Y., Ida, K., Idei, H., Inagaki, S., Inoue, N., Kado, S., Kubo, S., Kumazawa, R., Minami, T., Miyazawa, J., Morita, S., Murakami, S., Mutoh, T., & Muto, S. (2000). Edge thermal transport barrier In LHD discharges. Physical review letters, 84(1), 103-6. https://doi.org/10.1103/PhysRevLett.84.103
Ohyabu, et al. "Edge thermal transport barrier In LHD discharges." Physical review letters vol. 84,1 (2000): 103-6. doi: https://doi.org/10.1103/PhysRevLett.84.103
Ohyabu N, Narihara K, Funaba H, Morisaki T, Masuzaki S, Kawahata K, Komori A, Kaneko O, Yamada H, deVries P, Emoto M, Goto M, Hamada Y, Ida K, Idei H, Inagaki S, Inoue N, Kado S, Kubo S, Kumazawa R, Minami T, Miyazawa J, Morita S, Murakami S, Mutoh T, Muto S. Edge thermal transport barrier In LHD discharges. Phys Rev Lett. 2000 Jan 03;84(1):103-6. doi: 10.1103/PhysRevLett.84.103. PMID: 11015845.
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Phys Rev Lett. 2000 Jan 03;84(1):103-6. doi: 10.1103/PhysRevLett.84.103.

Edge thermal transport barrier In LHD discharges.

Physical review letters

Ohyabu, Narihara, Funaba, Morisaki, Masuzaki, Kawahata, Komori, Kaneko, Yamada, deVries, Emoto, Goto, Hamada, Ida, Idei, Inagaki, Inoue, Kado, Kubo, Kumazawa, Minami, Miyazawa, Morita, Murakami, Mutoh, Muto

Affiliations

  1. National Institute for Fusion Science, Toki, Gifu-ken, Japan.

PMID: 11015845 DOI: 10.1103/PhysRevLett.84.103

Abstract

In LHD discharges a significant enhancement of the global energy confinement has been achieved for the first time in a helical device with an edge thermal barrier, which exhibits a sharp gradient at the edge of the temperature profile. Key features associated with the barrier are quite different from those seen in tokamaks: (i) almost no change in particle (including impurity) transport, (ii) a gradual formation of the barrier, (iii) a very high ratio of the edge temperature to the average temperature, and (iv) no edge relaxation phenomenon. These features are very attractive in applying the thermal barrier to future reactor grade devices.

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