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Garcia R, Gómez CJ, Martinez NF, et al. Identification of nanoscale dissipation processes by dynamic atomic force microscopy. Phys Rev Lett. 2006;97(1):016103doi: 10.1103/PhysRevLett.97.016103.
Garcia, R., Gómez, C. J., Martinez, N. F., Patil, S., Dietz, C., & Magerle, R. (2006). Identification of nanoscale dissipation processes by dynamic atomic force microscopy. Physical review letters, 97(1), 016103. https://doi.org/10.1103/PhysRevLett.97.016103
Garcia, R, et al. "Identification of nanoscale dissipation processes by dynamic atomic force microscopy." Physical review letters vol. 97,1 (2006): 016103. doi: https://doi.org/10.1103/PhysRevLett.97.016103
Garcia R, Gómez CJ, Martinez NF, Patil S, Dietz C, Magerle R. Identification of nanoscale dissipation processes by dynamic atomic force microscopy. Phys Rev Lett. 2006 Jul 07;97(1):016103. doi: 10.1103/PhysRevLett.97.016103. Epub 2006 Jul 07. PMID: 16907387.
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Phys Rev Lett. 2006 Jul 07;97(1):016103. doi: 10.1103/PhysRevLett.97.016103. Epub 2006 Jul 07.

Identification of nanoscale dissipation processes by dynamic atomic force microscopy.

Physical review letters

R Garcia, C J Gómez, N F Martinez, S Patil, C Dietz, R Magerle

Affiliations

  1. Instituto de Microelectrónica de Madrid, CSIC, Isaac Newton 8, 28760 Tres Cantos, Madrid, Spain. [email protected]

PMID: 16907387 DOI: 10.1103/PhysRevLett.97.016103

Abstract

Identification of energy-dissipation processes at the nanoscale is demonstrated by using amplitude-modulation atomic force microscopy. The variation of the energy dissipated on a surface by a vibrating tip as a function of its oscillation amplitude has a shape that singles out the dissipative process occurring at the surface. The method is illustrated by calculating the energy-dissipation curves for surface energy hysteresis, long-range interfacial interactions and viscoelasticity. The method remains valid with independency of the amount of dissipated energy per cycle, from 0.1 to 50 eV. The agreement obtained between theory and experiments performed on silicon and polystyrene validates the method.

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