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Cho SW, Kim DI, Hwang BU, et al. Stability of pentacene thin film transistors under simultaneous mechanical bending and heating. J Nanosci Nanotechnol. 2013;13(12):8002-6doi: 10.1166/jnn.2013.8169.
Cho, S. W., Kim, D. I., Hwang, B. U., & Lee, N. E. (2013). Stability of pentacene thin film transistors under simultaneous mechanical bending and heating. Journal of nanoscience and nanotechnology, 13(12), 8002-6. https://doi.org/10.1166/jnn.2013.8169
Cho, Sung Won, et al. "Stability of pentacene thin film transistors under simultaneous mechanical bending and heating." Journal of nanoscience and nanotechnology vol. 13,12 (2013): 8002-6. doi: https://doi.org/10.1166/jnn.2013.8169
Cho SW, Kim DI, Hwang BU, Lee NE. Stability of pentacene thin film transistors under simultaneous mechanical bending and heating. J Nanosci Nanotechnol. 2013 Dec;13(12):8002-6. doi: 10.1166/jnn.2013.8169. PMID: 24266180.
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J Nanosci Nanotechnol. 2013 Dec;13(12):8002-6. doi: 10.1166/jnn.2013.8169.

Stability of pentacene thin film transistors under simultaneous mechanical bending and heating.

Journal of nanoscience and nanotechnology

Sung Won Cho, Do Il Kim, Byeong Ung Hwang, Nae-Eung Lee

Affiliations

  1. Department of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do 440-746, South Korea.

PMID: 24266180 DOI: 10.1166/jnn.2013.8169

Abstract

During the operational service of flexible electronic systems, component devices are subject to not only mechanical deformation but also environmental stimulation such as temperature and humidity. Therefore, the stability of flexible devices under simultaneous loading of multi-variable environmental factors including mechanical deformation needs to be studied. In this work, changes in device characteristics under simultaneous mechanical bending and heating of organic thin film transistors (OTFTs) were investigated in a mechanical bending system having capability of substrate heating. Simultaneous loading of mechanical deformation and heating of OTFTs accelerated the change of device characteristics such as field-effect mobility, threshold voltage, and subthreshold swing at elevated temperature. The results indicate that the stability of flexible devices under multi-variable loading needs to be tested for better understanding of the electrical behaviours of device characteristics in flexible electronics.

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