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Carey GH, Yuan M, Comin R, et al. Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids. ACS Appl Mater Interfaces. 2015;7(39):21995-2000doi: 10.1021/acsami.5b06890.
Carey, G. H., Yuan, M., Comin, R., Voznyy, O., & Sargent, E. H. (2015). Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids. ACS applied materials & interfaces, 7(39), 21995-2000. https://doi.org/10.1021/acsami.5b06890
Carey, Graham H, et al. "Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids." ACS applied materials & interfaces vol. 7,39 (2015): 21995-2000. doi: https://doi.org/10.1021/acsami.5b06890
Carey GH, Yuan M, Comin R, Voznyy O, Sargent EH. Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids. ACS Appl Mater Interfaces. 2015 Oct 07;7(39):21995-2000. doi: 10.1021/acsami.5b06890. Epub 2015 Sep 28. PMID: 26378717.
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ACS Appl Mater Interfaces. 2015 Oct 07;7(39):21995-2000. doi: 10.1021/acsami.5b06890. Epub 2015 Sep 28.

Cleavable Ligands Enable Uniform Close Packing in Colloidal Quantum Dot Solids.

ACS applied materials & interfaces

Graham H Carey, Mingjian Yuan, Riccardo Comin, Oleksandr Voznyy, Edward H Sargent

Affiliations

  1. The Edward S. Rogers Department of Electrical and Computer Engineering, University of Toronto , 10 King's College Road, Toronto, Ontario M5S 3G4, Canada.

PMID: 26378717 DOI: 10.1021/acsami.5b06890

Abstract

Uniform close packing in colloidal quantum dot solids is critical for high-optical density, high-mobility optoelectronic devices. A hybrid-ligand strategy is developed, combining the advantages of solid state and solution-phase ligand exchanges. This strategy uses a medium length thioamide ligand that is readily cleaved in a single chemical treatment, leading to quantum dot solids with uniformly packed domains 3 times larger than those observed in ligand-exchanged films.

Keywords: colloidal quantum dot; densification; ligand cleavage; thin films; thioamide

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