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Qiu L, Wang X, Su G, et al. Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film. Sci Rep. 2016;6:21014doi: 10.1038/srep21014.
Qiu, L., Wang, X., Su, G., Tang, D., Zheng, X., Zhu, J., Wang, Z., Norris, P. M., Bradford, P. D., & Zhu, Y. (2016). Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film. Scientific reports, 621014. https://doi.org/10.1038/srep21014
Qiu, Lin, et al. "Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film." Scientific reports vol. 6 (2016): 21014. doi: https://doi.org/10.1038/srep21014
Qiu L, Wang X, Su G, Tang D, Zheng X, Zhu J, Wang Z, Norris PM, Bradford PD, Zhu Y. Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film. Sci Rep. 2016 Feb 16;6:21014. doi: 10.1038/srep21014. PMID: 26880221; PMCID: PMC4754700.
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Sci Rep. 2016 Feb 16;6:21014. doi: 10.1038/srep21014.

Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film.

Scientific reports

Lin Qiu, Xiaotian Wang, Guoping Su, Dawei Tang, Xinghua Zheng, Jie Zhu, Zhiguo Wang, Pamela M Norris, Philip D Bradford, Yuntian Zhu

Affiliations

  1. Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, People's Republic of China.
  2. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22904-4746, USA.
  3. School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore.
  4. Shenhua Guohua (Beijing) Electric Power Research Institute Co., Ltd., Beijing 100025, People's Republic of China.
  5. Department of Mechanical Engineering, University of California, Riverside, CA 92521, USA.
  6. China National Electric Engineering Co., Ltd., Beijing 100048, People's Republic of China.
  7. Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695, USA.
  8. School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, People's Republic of China.

PMID: 26880221 PMCID: PMC4754700 DOI: 10.1038/srep21014

Abstract

It has been more than a decade since the thermal conductivity of vertically aligned carbon nanotube (VACNT) arrays was reported possible to exceed that of the best thermal greases or phase change materials by an order of magnitude. Despite tremendous prospects as a thermal interface material (TIM), results were discouraging for practical applications. The primary reason is the large thermal contact resistance between the CNT tips and the heat sink. Here we report a simultaneous sevenfold increase in in-plane thermal conductivity and a fourfold reduction in the thermal contact resistance at the flexible CNT-SiO2 coated heat sink interface by coupling the CNTs with orderly physical overlapping along the horizontal direction through an engineering approach (shear pressing). The removal of empty space rapidly increases the density of transport channels, and the replacement of the fine CNT tips with their cylindrical surface insures intimate contact at CNT-SiO2 interface. Our results suggest horizontally aligned CNT arrays exhibit remarkably enhanced in-plane thermal conductivity and reduced out-of-plane thermal conductivity and thermal contact resistance. This novel structure makes CNT film promising for applications in chip-level heat dissipation. Besides TIM, it also provides for a solution to anisotropic heat spreader which is significant for eliminating hot spots.

References

  1. Phys Rev Lett. 2001 Nov 19;87(21):215502 - PubMed
  2. Phys Rev Lett. 2005 Aug 5;95(6):065502 - PubMed
  3. Nanotechnology. 2009 May 6;20(18):185701 - PubMed
  4. ACS Nano. 2010 Oct 26;4(10):6187-95 - PubMed
  5. Nanoscale. 2012 Dec 7;4(23):7464-8 - PubMed
  6. Nanotechnology. 2012 May 25;23(20):205702 - PubMed
  7. Nat Mater. 2011 Jul 22;10(8):569-81 - PubMed
  8. Nat Commun. 2014;5:3082 - PubMed
  9. J Phys Chem B. 2006 Nov 2;110(43):21419-23 - PubMed
  10. Nano Lett. 2006 Aug;6(8):1589-93 - PubMed
  11. Nanotechnology. 2010 Jan 22;21(3):035709 - PubMed
  12. Phys Rev Lett. 2009 Mar 13;102(10):105901 - PubMed
  13. Phys Rev B Condens Matter. 1991 Aug 1;44(5):2142-2148 - PubMed
  14. Nanotechnology. 2009 Apr 8;20(14):145702 - PubMed
  15. Science. 2005 Nov 25;310(5752):1307-10 - PubMed

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