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Sci Rep. 2016 May 16;6:26032. doi: 10.1038/srep26032.

Self-regenerating and hybrid irreversible/reversible PDMS microfluidic devices.

Scientific reports

Letícia S Shiroma, Maria H O Piazzetta, Gerson F Duarte-Junior, Wendell K T Coltro, Emanuel Carrilho, Angelo L Gobbi, Renato S Lima

Affiliations

  1. Laboratório de Microfabricação, Laboratório Nacional de Nanotecnologia, Centro Nacional de Pesquisa em Energia e Materiais, Campinas, São Paulo 13083-970, Brasil.
  2. Instituto de Química, Universidade Federal de Goiás, Goiânia, Goiás 74001-970, Brasil.
  3. Instituto de Química de São Carlos, Universidade de São Paulo, São Carlos, São Paulo 13566-590, Brasil.

PMID: 27181918 PMCID: PMC4867595 DOI: 10.1038/srep26032

Abstract

This paper outlines a straightforward, fast, and low-cost method to fabricate polydimethylsiloxane (PDMS) chips. Termed sandwich bonding (SWB), this method requires only a laboratory oven. Initially, SWB relies on the reversible bonding of a coverslip over PDMS channels. The coverslip is smaller than the substrate, leaving a border around the substrate exposed. Subsequently, a liquid composed of PDMS monomers and a curing agent is poured onto the structure. Finally, the cover is cured. We focused on PDMS/glass chips because of their key advantages in microfluidics. Despite its simplicity, this method created high-performance microfluidic channels. Such structures featured self-regeneration after leakages and hybrid irreversible/reversible behavior. The reversible nature was achieved by removing the cover of PDMS with acetone. Thus, the PDMS substrate and glass coverslip could be detached for reuse. These abilities are essential in the stages of research and development. Additionally, SWB avoids the use of surface oxidation, half-cured PDMS as an adhesive, and surface chemical modification. As a consequence, SWB allows surface modifications before the bonding, a long time for alignment, the enclosure of sub-micron channels, and the prototyping of hybrid devices. Here, the technique was successfully applied to bond PDMS to Au and Al.

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