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Chang JK, Fang H, Bower CA, et al. Materials and processing approaches for foundry-compatible transient electronics. Proc Natl Acad Sci U S A. 2017;114(28):E5522-E5529doi: 10.1073/pnas.1707849114.
Chang, J. K., Fang, H., Bower, C. A., Song, E., Yu, X., & Rogers, J. A. (2017). Materials and processing approaches for foundry-compatible transient electronics. Proceedings of the National Academy of Sciences of the United States of America, 114(28), E5522-E5529. https://doi.org/10.1073/pnas.1707849114
Chang, Jan-Kai, et al. "Materials and processing approaches for foundry-compatible transient electronics." Proceedings of the National Academy of Sciences of the United States of America vol. 114,28 (2017): E5522-E5529. doi: https://doi.org/10.1073/pnas.1707849114
Chang JK, Fang H, Bower CA, Song E, Yu X, Rogers JA. Materials and processing approaches for foundry-compatible transient electronics. Proc Natl Acad Sci U S A. 2017 Jul 11;114(28):E5522-E5529. doi: 10.1073/pnas.1707849114. Epub 2017 Jun 26. PMID: 28652373; PMCID: PMC5514770.
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Proc Natl Acad Sci U S A. 2017 Jul 11;114(28):E5522-E5529. doi: 10.1073/pnas.1707849114. Epub 2017 Jun 26.

Materials and processing approaches for foundry-compatible transient electronics.

Proceedings of the National Academy of Sciences of the United States of America

Jan-Kai Chang, Hui Fang, Christopher A Bower, Enming Song, Xinge Yu, John A Rogers

Affiliations

  1. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  2. Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801.
  3. Department of Electrical and Computer Engineering, Northeastern University, Boston, MA 02115.
  4. X-Celeprint, Inc., Durham, NC 27709.
  5. Department of Materials Science, Fudan University, Shanghai 200433, People's Republic of China.
  6. Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801; [email protected].
  7. Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208.
  8. Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208.
  9. Department of Neurological Surgery, Northwestern University, Evanston, IL 60208.
  10. Department of Chemistry, Northwestern University, Evanston, IL 60208.
  11. Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208.
  12. Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208.
  13. Simpson Querrey Institute, Northwestern University, Evanston, IL 60208.
  14. Feinberg School of Medicine, Northwestern University, Evanston, IL 60208.
  15. Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208.

PMID: 28652373 PMCID: PMC5514770 DOI: 10.1073/pnas.1707849114

Abstract

Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for "green" electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (

Keywords: biodegradable electronics; hydrolysis; soft electronics; transfer printing; undercut etching

Conflict of interest statement

The authors declare no conflict of interest.

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