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Valentine AD, Busbee TA, Boley JW, et al. Hybrid 3D Printing of Soft Electronics. Adv Mater. 2017;29(40)doi: 10.1002/adma.201703817.
Valentine, A. D., Busbee, T. A., Boley, J. W., Raney, J. R., Chortos, A., Kotikian, A., Berrigan, J. D., Durstock, M. F., & Lewis, J. A. (2017). Hybrid 3D Printing of Soft Electronics. Advanced materials (Deerfield Beach, Fla.), 29(40), . https://doi.org/10.1002/adma.201703817
Valentine, Alexander D, et al. "Hybrid 3D Printing of Soft Electronics." Advanced materials (Deerfield Beach, Fla.) vol. 29,40 (2017). doi: https://doi.org/10.1002/adma.201703817
Valentine AD, Busbee TA, Boley JW, Raney JR, Chortos A, Kotikian A, Berrigan JD, Durstock MF, Lewis JA. Hybrid 3D Printing of Soft Electronics. Adv Mater. 2017 Oct;29(40). doi: 10.1002/adma.201703817. Epub 2017 Sep 06. PMID: 28875572.
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Adv Mater. 2017 Oct;29(40). doi: 10.1002/adma.201703817. Epub 2017 Sep 06.

Hybrid 3D Printing of Soft Electronics.

Advanced materials (Deerfield Beach, Fla.)

Alexander D Valentine, Travis A Busbee, John William Boley, Jordan R Raney, Alex Chortos, Arda Kotikian, John Daniel Berrigan, Michael F Durstock, Jennifer A Lewis

Affiliations

  1. Pierce Hall Rm 221, 29 Oxford Street, Cambridge, MA, 02138, USA.
  2. Soft Materials Branch, Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright Patterson Air Force Base, OH, 45433, USA.

PMID: 28875572 DOI: 10.1002/adma.201703817

Abstract

Hybrid 3D printing is a new method for producing soft electronics that combines direct ink writing of conductive and dielectric elastomeric materials with automated pick-and-place of surface mount electronic components within an integrated additive manufacturing platform. Using this approach, insulating matrix and conductive electrode inks are directly printed in specific layouts. Passive and active electrical components are then integrated to produce the desired electronic circuitry by using an empty nozzle (in vacuum-on mode) to pick up individual components, place them onto the substrate, and then deposit them (in vacuum-off mode) in the desired location. The components are then interconnected via printed conductive traces to yield soft electronic devices that may find potential application in wearable electronics, soft robotics, and biomedical devices.

© 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Keywords: conductive elastomers; multimaterial 3D printing; pick-and-place; soft sensors

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