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Wang J, Xia Q, Ma Y, et al. Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale. Materials (Basel). 2017;10(10)doi: 10.3390/ma10101128.
Wang, J., Xia, Q., Ma, Y., Meng, F., Liang, Y., & Li, Z. (2017). Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale. Materials (Basel, Switzerland), 10(10), . https://doi.org/10.3390/ma10101128
Wang, Jianmei, et al. "Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale." Materials (Basel, Switzerland) vol. 10,10 (2017). doi: https://doi.org/10.3390/ma10101128
Wang J, Xia Q, Ma Y, Meng F, Liang Y, Li Z. Interfacial Bonding Energy on the Interface between ZChSnSb/Sn Alloy Layer and Steel Body at Microscale. Materials (Basel). 2017 Sep 25;10(10). doi: 10.3390/ma10101128. PMID: 28946690; PMCID: PMC5666934.
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