Display options
Cite
Zope KR, Cormier D, Williams SA. Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates. ACS Appl Mater Interfaces. 2018;10(4):3830-3837doi: 10.1021/acsami.7b19161.
Zope, K. R., Cormier, D., & Williams, S. A. (2018). Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates. ACS applied materials & interfaces, 10(4), 3830-3837. https://doi.org/10.1021/acsami.7b19161
Zope, Khushbu R, et al. "Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates." ACS applied materials & interfaces vol. 10,4 (2018): 3830-3837. doi: https://doi.org/10.1021/acsami.7b19161
Zope KR, Cormier D, Williams SA. Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates. ACS Appl Mater Interfaces. 2018 Jan 31;10(4):3830-3837. doi: 10.1021/acsami.7b19161. Epub 2018 Jan 19. PMID: 29303549.
Copy Download .nbib Format: NLM
Share it on

ACS Appl Mater Interfaces. 2018 Jan 31;10(4):3830-3837. doi: 10.1021/acsami.7b19161. Epub 2018 Jan 19.

Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates.

ACS applied materials & interfaces

Khushbu R Zope, Denis Cormier, Scott A Williams

Affiliations

  1. School of Chemistry and Materials Science, Rochester Institute of Technology , Rochester, New York 14623, United States.
  2. Department of Industrial and Systems Engineering, Rochester Institute of Technology , Rochester, New York 14623, United States.

PMID: 29303549 DOI: 10.1021/acsami.7b19161

Abstract

A solid silver-ligand complex, μ-oxolato-bis(ethylenediaminesilver(I)), was developed for formulating particle-free conductive metal-organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink formulation with 29.5 wt % silver content was developed and inkjet printed onto glass, polyethylene terephthalate, and polyimide substrates. A new hybrid thermal-photonic curing approach resulting in substantially improved electrical properties and substrate adhesion is presented. Silver conductive traces were measured to have bulk resistivity of 4.26 × 10

Keywords: metal−organic decomposition; photonic curing; printed electronics; reactive silver; silver oxalate complex

Publication Types