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Fraczkiewicz A, Lorut F, Audoit G, et al. 3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars. Ultramicroscopy. 2018;193:71-83doi: 10.1016/j.ultramic.2018.04.012.
Fraczkiewicz, A., Lorut, F., Audoit, G., Boller, E., Capria, E., Cloetens, P., Da Silva, J., Farcy, A., Mourier, T., Ponthenier, F., & Bleuet, P. (2018). 3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars. Ultramicroscopy, 19371-83. https://doi.org/10.1016/j.ultramic.2018.04.012
Fraczkiewicz, A, et al. "3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars." Ultramicroscopy vol. 193 (2018): 71-83. doi: https://doi.org/10.1016/j.ultramic.2018.04.012
Fraczkiewicz A, Lorut F, Audoit G, Boller E, Capria E, Cloetens P, Da Silva J, Farcy A, Mourier T, Ponthenier F, Bleuet P. 3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars. Ultramicroscopy. 2018 Oct;193:71-83. doi: 10.1016/j.ultramic.2018.04.012. Epub 2018 Jun 15. PMID: 29957329.
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Ultramicroscopy. 2018 Oct;193:71-83. doi: 10.1016/j.ultramic.2018.04.012. Epub 2018 Jun 15.

3D high resolution imaging for microelectronics: A multi-technique survey on copper pillars.

Ultramicroscopy

A Fraczkiewicz, F Lorut, G Audoit, E Boller, E Capria, P Cloetens, J Da Silva, A Farcy, T Mourier, F Ponthenier, P Bleuet

Affiliations

  1. Univ. Grenoble Alpes, Grenoble F-38000, France; CEA, LETI, MINATEC Campus, Grenoble F-38054, France.
  2. STMicroelectronics, 850 rue Jean Monnet, Crolles 38926, France.
  3. European Synchrotron Radiation Facility, B.P. 220, Grenoble F-38043, France.
  4. Univ. Grenoble Alpes, Grenoble F-38000, France; CEA, LETI, MINATEC Campus, Grenoble F-38054, France. Electronic address: [email protected].

PMID: 29957329 DOI: 10.1016/j.ultramic.2018.04.012

Abstract

In microelectronics, recently developed 3D integration offers the possibility to stack the dice or wafers vertically instead of putting their different parts next to one another, in order to save space. As this method becomes of greater interest, the need for 3D imaging techniques becomes higher. We here report a study about different 3D characterization techniques applied to copper pillars, which are used to stack different dice together. Destructive techniques such as FIB/SEM, FIB/FIB, and PFIB/PFIB slice and view protocols have been assessed, as well as non-destructive ones, such as laboratory-based and synchrotron-based computed tomographies. A comparison of those techniques in the specific case of copper pillars is given, taking into account the constraints linked to the microelectronics industry, mainly concerning resolution and sample throughput. Laboratory-based imaging techniques are shown to be relevant in the case of punctual analyses, while synchrotron based tomographies offer highly resolved volumes for larger batches of samples.

Copyright © 2018. Published by Elsevier B.V.

Keywords: 3D imaging; 3D integration; Copper pillars; Slice and view; Synchrotron; X-ray tomography

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