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Furusawa A, Hine K, Hayashi Y, et al. Formation of particle of bismuth-indium alloys and particle diameter by ultrasonic cavitation. Ultrason Sonochem. 2018;50:322-330doi: 10.1016/j.ultsonch.2018.09.034.
Furusawa, A., Hine, K., Hayashi, Y., & Takizawa, H. (2019). Formation of particle of bismuth-indium alloys and particle diameter by ultrasonic cavitation. Ultrasonics sonochemistry, 50322-330. https://doi.org/10.1016/j.ultsonch.2018.09.034
Furusawa, Akio, et al. "Formation of particle of bismuth-indium alloys and particle diameter by ultrasonic cavitation." Ultrasonics sonochemistry vol. 50 (2019): 322-330. doi: https://doi.org/10.1016/j.ultsonch.2018.09.034
Furusawa A, Hine K, Hayashi Y, Takizawa H. Formation of particle of bismuth-indium alloys and particle diameter by ultrasonic cavitation. Ultrason Sonochem. 2019 Jan;50:322-330. doi: 10.1016/j.ultsonch.2018.09.034. Epub 2018 Sep 24. PMID: 30314819.
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Ultrason Sonochem. 2019 Jan;50:322-330. doi: 10.1016/j.ultsonch.2018.09.034. Epub 2018 Sep 24.

Formation of particle of bismuth-indium alloys and particle diameter by ultrasonic cavitation.

Ultrasonics sonochemistry

Akio Furusawa, Kiyohiro Hine, Yamato Hayashi, Hirotsugu Takizawa

Affiliations

  1. Production Engineering Laboratory, Panasonic Corporation, Osaka 5718502, Japan; Department of Applied Chemistry, Tohoku University, Miyagi 9808579, Japan. Electronic address: [email protected].
  2. Production Engineering Laboratory, Panasonic Corporation, Osaka 5718502, Japan.
  3. Department of Applied Chemistry, Tohoku University, Miyagi 9808579, Japan.

PMID: 30314819 DOI: 10.1016/j.ultsonch.2018.09.034

Abstract

The miniaturization of electronic equipment requires fine bonding. Therefore, it is necessary to miniaturize the solder particles used for bonding different materials. Ultrasonic cavitation is a technique that uses ultrasonic irradiation to synthesize such microparticles. In this study, we investigated the effects of ultrasonic irradiation conditions on synthetic microparticles produced by this technique. Spherical particles were obtained by irradiating Bi-45 wt% In melted in a solvent with ultrasonic waves for 15 s, and the resultant metal composition was found to be equivalent to the raw material composition. We found a clear correlation between the ultrasonic irradiation time and particle size. When irradiated for 60 min, the average particle diameter was 3.3 μm. In addition, the particle division rate decreased as the irradiation time increased, which is probably due to attenuation of the vibration wave as the boundary surface increased with the refinement of the particle.

Copyright © 2018 Elsevier B.V. All rights reserved.

Keywords: Bi-45 wt% In; Cavitation; Irradiation time; Solder particle; Ultrasonic wave

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