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Vaziri S, Yalon E, Muñoz Rojo M, et al. Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials. Sci Adv. 2019;5(8):eaax1325doi: 10.1126/sciadv.aax1325.
Vaziri, S., Yalon, E., Muñoz Rojo, M., Suryavanshi, S. V., Zhang, H., McClellan, C. J., Bailey, C. S., Smithe, K. K. H., Gabourie, A. J., Chen, V., Deshmukh, S., Bendersky, L., Davydov, A. V., & Pop, E. (2019). Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials. Science advances, 5(8), eaax1325. https://doi.org/10.1126/sciadv.aax1325
Vaziri, Sam, et al. "Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials." Science advances vol. 5,8 (2019): eaax1325. doi: https://doi.org/10.1126/sciadv.aax1325
Vaziri S, Yalon E, Muñoz Rojo M, Suryavanshi SV, Zhang H, McClellan CJ, Bailey CS, Smithe KKH, Gabourie AJ, Chen V, Deshmukh S, Bendersky L, Davydov AV, Pop E. Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials. Sci Adv. 2019 Aug 16;5(8):eaax1325. doi: 10.1126/sciadv.aax1325. eCollection 2019 Aug. PMID: 31453337; PMCID: PMC6697438.
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Sci Adv. 2019 Aug 16;5(8):eaax1325. doi: 10.1126/sciadv.aax1325. eCollection 2019 Aug.

Ultrahigh thermal isolation across heterogeneously layered two-dimensional materials.

Science advances

Sam Vaziri, Eilam Yalon, Miguel Muñoz Rojo, Saurabh V Suryavanshi, Huairuo Zhang, Connor J McClellan, Connor S Bailey, Kirby K H Smithe, Alexander J Gabourie, Victoria Chen, Sanchit Deshmukh, Leonid Bendersky, Albert V Davydov, Eric Pop

Affiliations

  1. Department of Electrical Engineering, Stanford University, Stanford, CA 94305, USA.
  2. Theiss Research Inc., La Jolla, CA 92037, USA.
  3. Materials Science and Engineering Division, National Institute of Standards and Technology (NIST), Gaithersburg, MA 20899, USA.
  4. Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305, USA.
  5. Precourt Institute for Energy, Stanford University, Stanford, CA 94305, USA.

PMID: 31453337 PMCID: PMC6697438 DOI: 10.1126/sciadv.aax1325

Abstract

Heterogeneous integration of nanomaterials has enabled advanced electronics and photonics applications. However, similar progress has been challenging for thermal applications, in part due to shorter wavelengths of heat carriers (phonons) compared to electrons and photons. Here, we demonstrate unusually high thermal isolation across ultrathin heterostructures, achieved by layering atomically thin two-dimensional (2D) materials. We realize artificial stacks of monolayer graphene, MoS

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