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Kozłowski P, Czuba K, Chmielewski K, et al. Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing. Materials (Basel). 2021;14(21)doi: 10.3390/ma14216269.
Kozłowski, P., Czuba, K., Chmielewski, K., Ratajczak, J., Branas, J., Korczyc, A., Regiński, K., & Jasik, A. (2021). Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing. Materials (Basel, Switzerland), 14(21), . https://doi.org/10.3390/ma14216269
Kozłowski, Paweł, et al. "Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing." Materials (Basel, Switzerland) vol. 14,21 (2021). doi: https://doi.org/10.3390/ma14216269
Kozłowski P, Czuba K, Chmielewski K, Ratajczak J, Branas J, Korczyc A, Regiński K, Jasik A. Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing. Materials (Basel). 2021 Oct 21;14(21). doi: 10.3390/ma14216269. PMID: 34771804; PMCID: PMC8584861.
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Materials (Basel). 2021 Oct 21;14(21). doi: 10.3390/ma14216269.

Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing.

Materials (Basel, Switzerland)

Paweł Kozłowski, Krzysztof Czuba, Krzysztof Chmielewski, Jacek Ratajczak, Joanna Branas, Adam Korczyc, Kazimierz Regiński, Agata Jasik

Affiliations

  1. ?ukasiewicz Research Network-Institute of Microelectronics and Photonics, al. Lotników 32/46, 02-668 Warsaw, Poland.

PMID: 34771804 PMCID: PMC8584861 DOI: 10.3390/ma14216269

Abstract

Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of indium has been optimized to achieve ~8 μm-thick layers with a small surface roughness of R

Keywords: annealing; indium bumps; infrared photodetectors; metallization; thermal evaporation; wet etching

References

  1. Rep Prog Phys. 2016 Apr;79(4):046501 - PubMed

Publication Types

Grant support