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Jian-Guang Y, Jie L, Si-Yao P, et al. A new membrane electro-deposition based process for tin recovery from waste printed circuit boards. J Hazard Mater. 2015;304:409-16doi: 10.1016/j.jhazmat.2015.11.007.
Jian-Guang, Y., Jie, L., Si-Yao, P., Yuan-Lu, L., & Wei-Qiang, S. (2016). A new membrane electro-deposition based process for tin recovery from waste printed circuit boards. Journal of hazardous materials, 304409-16. https://doi.org/10.1016/j.jhazmat.2015.11.007
Jian-Guang, Yang, et al. "A new membrane electro-deposition based process for tin recovery from waste printed circuit boards." Journal of hazardous materials vol. 304 (2016): 409-16. doi: https://doi.org/10.1016/j.jhazmat.2015.11.007
Jian-Guang Y, Jie L, Si-Yao P, Yuan-Lu L, Wei-Qiang S. A new membrane electro-deposition based process for tin recovery from waste printed circuit boards. J Hazard Mater. 2016 Mar 05;304:409-16. doi: 10.1016/j.jhazmat.2015.11.007. Epub 2015 Nov 10. PMID: 26595900.
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