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Chemistry. 2015 Dec 01;21(49):17762-8. doi: 10.1002/chem.201502825. Epub 2015 Oct 19.

Cross-linked Polymer-Blend Gate Dielectrics through Thermal Click Chemistry.

Chemistry (Weinheim an der Bergstrasse, Germany)

Shengxia Li, Wei Tang, Weimin Zhang, Xiaojun Guo, Qing Zhang

Affiliations

  1. Shanghai Key Lab of Polymer and Electrical Insulation, Department of Polymer Science and Engineering, School of Chemistry and Chemical Engineering, Shanghai JiaoTong University, Shanghai 200240 (China).
  2. National Engineering Laboratory of TFT-LCD Materials and Technologies, Department of Electronic Engineering, Shanghai JiaoTong University, Shanghai 200240 (China).
  3. College of Chemistry and Chemical Engineering, Guangxi University for Nationalities, Nanning 530006 (China).
  4. National Engineering Laboratory of TFT-LCD Materials and Technologies, Department of Electronic Engineering, Shanghai JiaoTong University, Shanghai 200240 (China). [email protected].
  5. Shanghai Key Lab of Polymer and Electrical Insulation, Department of Polymer Science and Engineering, School of Chemistry and Chemical Engineering, Shanghai JiaoTong University, Shanghai 200240 (China). [email protected].

PMID: 26477514 DOI: 10.1002/chem.201502825

Abstract

New cross-linking reagents were synthesized and mixed with polystyrene (PS) in solution to form a blend. Thin-films were spin-coated from the blend and then cross-linked by thermal activation at relatively low temperature (100 °C) to form cross-linked gate dielectrics. This new method is compatible with plastic substrates in flexible electronics. The azide and alkyne cross-linking reagents are kinetically stable at room temperature, so any premature cross-linking is avoided during processing. This method also significantly improved the dielectric performances of PS thin films. Solution-processed top-gate organic field-effect transistor devices with indacenodithiophene-benzothiadiazole copolymer as semiconductor layer and the cross-linked PS blend as dielectric layer showed improved performances with lower gate leakages and higher operation stabilities than devices with neat PS film as dielectric layer.

© 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Keywords: click chemistry; cross-linking agents; device fabrication; dielectrics; polymer blends

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