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Wie DS, Zhang Y, Kim MK, et al. Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics. Proc Natl Acad Sci U S A. 2018;115(31):E7236-E7244doi: 10.1073/pnas.1806640115.
Wie, D. S., Zhang, Y., Kim, M. K., Kim, B., Park, S., Kim, Y. J., Irazoqui, P. P., Zheng, X., Xu, B., & Lee, C. H. (2018). Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics. Proceedings of the National Academy of Sciences of the United States of America, 115(31), E7236-E7244. https://doi.org/10.1073/pnas.1806640115
Wie, Dae Seung, et al. "Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics." Proceedings of the National Academy of Sciences of the United States of America vol. 115,31 (2018): E7236-E7244. doi: https://doi.org/10.1073/pnas.1806640115
Wie DS, Zhang Y, Kim MK, Kim B, Park S, Kim YJ, Irazoqui PP, Zheng X, Xu B, Lee CH. Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics. Proc Natl Acad Sci U S A. 2018 Jul 31;115(31):E7236-E7244. doi: 10.1073/pnas.1806640115. Epub 2018 Jul 16. PMID: 30012591; PMCID: PMC6077709.
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Proc Natl Acad Sci U S A. 2018 Jul 31;115(31):E7236-E7244. doi: 10.1073/pnas.1806640115. Epub 2018 Jul 16.

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

Proceedings of the National Academy of Sciences of the United States of America

Dae Seung Wie, Yue Zhang, Min Ku Kim, Bongjoong Kim, Sangwook Park, Young-Joon Kim, Pedro P Irazoqui, Xiaolin Zheng, Baoxing Xu, Chi Hwan Lee

Affiliations

  1. School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907.
  2. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22903.
  3. Department of Mechanical Engineering, Stanford University, Stanford, CA 94305.
  4. School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907.
  5. Center for Implantable Devices, Purdue University, West Lafayette, IN 47907.
  6. Weldon School of Biomedical Engineering, Purdue University, West Lafayette, IN 47907.
  7. Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, VA 22903; [email protected] [email protected].
  8. School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907; [email protected] [email protected].

PMID: 30012591 PMCID: PMC6077709 DOI: 10.1073/pnas.1806640115

Abstract

Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.

Keywords: Internet of Things; delamination; nondestructive wafer recycling; thin-film nanoelectronics; transfer printing method

Conflict of interest statement

The authors declare no conflict of interest.

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