Cite
Wang M, Zhong S, Yin XB, et al. Nanostructured copper filaments in electrochemical deposition. Phys Rev Lett. 2001;86(17):3827-30doi: 10.1103/PhysRevLett.86.3827.
Wang, M., Zhong, S., Yin, X. B., Zhu, J. M., Peng, R. W., Wang, Y., Zhang, K. Q., & Ming, N. B. (2001). Nanostructured copper filaments in electrochemical deposition. Physical review letters, 86(17), 3827-30. https://doi.org/10.1103/PhysRevLett.86.3827
Wang, M, et al. "Nanostructured copper filaments in electrochemical deposition." Physical review letters vol. 86,17 (2001): 3827-30. doi: https://doi.org/10.1103/PhysRevLett.86.3827
Wang M, Zhong S, Yin XB, Zhu JM, Peng RW, Wang Y, Zhang KQ, Ming NB. Nanostructured copper filaments in electrochemical deposition. Phys Rev Lett. 2001 Apr 23;86(17):3827-30. doi: 10.1103/PhysRevLett.86.3827. PMID: 11329334.
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