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Cheong LL, Paul P, Holzner F, et al. Thermal probe maskless lithography for 27.5 nm half-pitch Si technology. Nano Lett. 2013;13(9):4485-91doi: 10.1021/nl4024066.
Cheong, L. L., Paul, P., Holzner, F., Despont, M., Coady, D. J., Hedrick, J. L., Allen, R., Knoll, A. W., & Duerig, U. (2013). Thermal probe maskless lithography for 27.5 nm half-pitch Si technology. Nano letters, 13(9), 4485-91. https://doi.org/10.1021/nl4024066
Cheong, Lin Lee, et al. "Thermal probe maskless lithography for 27.5 nm half-pitch Si technology." Nano letters vol. 13,9 (2013): 4485-91. doi: https://doi.org/10.1021/nl4024066
Cheong LL, Paul P, Holzner F, Despont M, Coady DJ, Hedrick JL, Allen R, Knoll AW, Duerig U. Thermal probe maskless lithography for 27.5 nm half-pitch Si technology. Nano Lett. 2013 Sep 11;13(9):4485-91. doi: 10.1021/nl4024066. Epub 2013 Aug 23. PMID: 23965001.
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